用SEBS热塑弹性体为热封层的SMD热封上带的技术研发  Development of SMD heat sealing technology applying
用SEBS热塑弹性体为热封层的SMD热封上带的技术研发 Development of SMD heat sealing technology applying
  • 行业分类:生物医药和大健康产业
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       该产品质量稳定、性能优质,不仅取代改性的PE粒子为热封层,有效的改善热封上带与载带的匹配性,提升上带的兼容性;同时解决膜成型后自粘问题,密封效果好,只需适当的拉力就能拉开,填补了国内生产上带的空白,降低了上带的使用成本。 
 
       The quality of productsare very stable and good performance function., To replace the heat sealing layer of PE particles, which is improved of function, can effectively improve the thermal sealing belt and load matching between cover and carrier, at the same time to solve the problem of adhesive film forming after and good sealing effect also. And just open the appropriate tension can easily remove, We can match the domestic production capacities and can reduce the production cost of cover products.\\

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